Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
Delving Into Special Sessions at IPC APEX EXPO 2024
May 28, 2024 | Happy Holden, I-Connect007Estimated reading time: 1 minute
Once again, we were back at IPC APEX EXPO for another show and conference, and back to gathering in the Anaheim Convention Center. With Disneyland just across the street, there were tourists everywhere.
This APEX EXPO was bigger than ever, with more activities, Professional Development Courses, standards committee meetings, and the 16th Electronic Circuits World Convention. I really enjoyed walking around and seeing everything the show had to offer.
After an excellent keynote on Tuesday by Paul Bailey titled “The Art of the Impossible,” the show opened, and a large crowd surged in. I spent the day walking the aisles and looking at all the technologies. One factor that kept recurring was the use of artificial intelligence (AI) as a catchphrase. It was difficult to really understand what part of AI was being employed, but it was the use of rule-based learning of errors that could then be used to correct the root causes. Many of the Real Time With… interviews conducted in the I-Connect007 booth discussed the prevalence of AI.
One of the highlights for me was the Taiwan High-Tech Forum on Wednesday, presented by the Taiwan Printed Circuit Association (TPCA). TSMC provided opening remarks about the super-IC fabrication for the world. They showed a very slick video about their processes and packaging. Other Taiwan luminaries, including the Industrial Technology Research Institute (ITRI), gave an overview of its research for IC packaging and critical materials. This was followed by key Taiwan packaging substrate suppliers like Unimicron and Kinsus Interconnect Technology Corp., where leaders reviewed their technologies, capabilities, and materials. As the day went on, it seemed that the presentations were increasingly about marketing rather than technical presentations, as very few facts and data were presented; it was more about products and capabilities.
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Share on:
Suggested Items
Nordson Reports Q2 Fiscal 2025 Results and Q3 Guidance
05/30/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal second quarter ended April 30, 2025. Sales were $683 million compared to the prior year’s second quarter sales of $651 million.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
IDC Introduces the Enterprise PC Trust Perception Index
05/21/2025 | IDCThe Enterprise PC Trust Index, International Data Corporation’s (IDC) first independent study of PC vendors in the trust space, was issued.
Eltek Reports 2025 Q1 Financial Results; Revenue Up 8%
05/20/2025 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), announced its financial results for the quarter ended March 31, 2025.
Mycronic High Flex Changes Division Name to PCB Assembly Solutions
05/20/2025 | MycronicMycronic AB, the leading Sweden-based electronics assembly solutions provider, announced that its division formerly known as High Flex will now operate under the name PCB Assembly Solutions.