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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
September 8, 2025 | I-Connect007Estimated reading time: Less than a minute
In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Optimize the InterconnectSM series explores how MKS is reshaping microvia formation to meet the challenges of today’s most advanced HDI PCB and substrate designs.
Listeners can also download a free companion guide for a deeper technical dive into unified via formation. The guide includes case studies that showcase the measurable performance gains of OTI in action.
Stay tuned—the final episode in the series is scheduled to air September 18.
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Simon Khesin - Schmoll MaschinenSuggested Items
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
Vuzix Ships Follow-On Production Order from Major Defense Customer for Waveguide-Based AR
04/06/2026 | PRNewswireVuzix® Corporation, a leading supplier of AI-powered smart glasses, waveguides, and augmented reality technologies, announced that it has received and shipped against a new six-figure follow-on production order for waveguide-based AR display systems from a U.S.-based company that is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/18/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
03/06/2026 | I-Connect007I-Connect007 announces the release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new book offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.