Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
All Flex Solutions Invests in Assembly Inspection Automation
October 17, 2024 | All Flex SolutionsEstimated reading time: 1 minute
All Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
The VP9000 3D Solder Paste Inspection System reviews the solder paste deposit directly after printing, and solder prior to component placement. The VT-S1080 3D Automatic Optical Inspection System (AOI) reviews the reflowed solder deposit after assembly of components to the board. The VT-S1080 can also inspect slightly underneath the components to get a more complete picture of the reflowed solder filet.
The two systems work together to provide continuous closed loop data communication to optimize the solder paste printing operation for continuous, real time process improvement during manufacturing. The two machines work together to provide the ideal solder filet for assembly, providing quantitative inspection that conforms to international standards.
Both systems use advanced vision systems to accurately measure solder features, eliminating image noise such as component shadows, solder reflections and warpage in the PCB’s themselves.
These two additions will help optimize our solder printing profiles to match the components, and their surface mount lands, moving us to zero defects in our assembly operation. Assembling flexible circuits, flexible heaters and rigid flex circuits can present challenges. The boards are not always flat and planar and can often move quite a bit prior to, during and after assembly. This technology will improve our manufacturing consistency and yields in assembly.
The assembly side of the business has grown over the years, and so too has the complexity of today’s electronic assemblies, creating an environment where continuous improvement is critical for high manufacturing yields.
Share on:
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.