Dan’s Biz Bookshelf: ‘In Defense of a Liberal Education’
American Made Advocacy: A Growing Presence in Washington in Turbulent Times
It’s Only Common Sense: How to Win Back Lost Customers
TRI Launches High-Speed 3D AXI for Semiconductor Applications
October 18, 2024 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, proudly announces the release of the high-throughput 3D SEMI CT AXI TR7600 SIII Plus, specifically designed for high-reliability electronics manufacturing, including the Semiconductor and Advanced Packaging industries.
Equipped with a Multi – High-Resolution configuration 2 µm - 20 µm, the TR7600 SIII Plus is an optimal addition to high-reliability electronics manufacturing industries such as Automotive, Aerospace, and Medical. The TR7600 SIII Plus delivers High-Speed Inspection tailored to the throughput requirements of OSATs (Outsourced Semiconductor Assembly and Test providers) and integrates AI-Powered Inspection Algorithms, including AI-Void Detection and AI Repair Station to enhance defect detection rates.
The TR7600 SIII Plus is capable of inspecting C4 Bumps, from 70µm - 140µm, SiP and Cu Pillars. The AXI can inspect large boards of up to 800 x 350 mm in size and 12 kg in weight, ideal for advanced manufacturing environments.
The TR7600 SIII Plus integrates with Smart Factory production lines and MES, ensuring inspection traceability. The TR7600 SIII Plus supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
China Plus One, Part 3: Inorsen Group, a Vietnam Success Story
07/03/2025 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.In recent years, Western OEMs have continued to push for China Plus One factories and the advancement of China’s Belt and Road Initiative (BRI). At present, there are two main modes for PCB companies to go global: building greenfield factories or through mergers and acquisitions (M&A). Thailand is currently the primary geographic choice to build greenfield factories, whereas, increasingly, mergers and acquisitions in Vietnam and Malaysia provide opportunities for companies to expand markets and acquire resources.
MKS Instruments Reports Q1 2025 Financial Results
05/16/2025 | Globe NewswireMKS Instruments, Inc., a global provider of enabling technologies that transform our world, today reported first quarter 2025 financial results.
Linkage Technologies, Inc. Celebrates 10 Years of Excellence in PCB Solutions
04/22/2025 | Linkage Technologies, Inc.Linkage Technologies, Inc., a premier provider of printed circuit boards (PCBs) sourced from Asia, proudly marks its 10th anniversary, celebrating a decade of exceptional growth, unwavering commitment to quality, and dependable delivery.
TRI: Inspection Innovations at Focus on PCB Expo
04/09/2025 | TRII-Tronik, TRI's distributor, will showcase cutting-edge AI-powered inspection solutions at Focus on PCB 2025, taking place at Fiera di Vicenza, Italy, from May 21–22, 2025.
Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications
03/03/2025 | Rogers CorporationRogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.