CEE PCB to Exhibit at Electronica 2024
October 31, 2024 | CEE PCBEstimated reading time: 1 minute
Tom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.
When making the announcement, Mr. Yang said, “This is a very important show for us, especially this year as we have started assuming our position on the global stage. We plan to have many of our experts at the show ready to meet and discuss new projects with current and future customers.”
Huizhou CEE Technology Inc. (Stock Code:002579), founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. Their offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F) and flexible printed circuit assembly (FPCA). With three state-of-the-art factories located in key industrial hubs, CEE PCB is recognized as a key high-tech enterprise under the National Torch Program, hold the position of Vice Chairperson in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters.
CEE PCB will be exhibiting as Huizhou CEE Technology Inc. in booth C6.361.
Suggested Items
Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
05/29/2025 | Amphenol Printed CircuitsAmphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Global PCB Market Forecast to Reach $86.5 Billion by 2029 with 5.9% Annual Growth
05/19/2025 | EINPresswire.comThe printed circuit board market size has witnessed steady growth in recent years and the trend is anticipated to continue. Increasing from $65.82 billion in 2024 to $68.75 billion in 2025, it showcases a compound annual growth rate CAGR of 4.5%.
Roca Printed Circuits Joins Forces with Epec Engineered Technologies, NetVia
05/14/2025 | Epec Engineering TechnologiesRoca Printed Circuits and Epec Engineered Technologies announced today that Roca has joined forces with Epec’s NetVia Group PCB division in Dallas, expanding the combined organization's ability to deliver a broader range of high-quality printed circuit boards and electronic solutions.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.