IPC Issues Call for Participation for IPC APEX EXPO 2026

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IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026. The technical conference, reimagined and renamed to Advanced Electronic Packaging Conference 2026 Component- to System-Level Integration, will be held March 17-19 and professional development courses will take place March 15-16 and 19, 2026, at the Anaheim Convention Center in Anaheim, Calif.

“While the format and scope of the conference are being transformed, the core technical content our industry relies on is not only being preserved—it’s being expanded to better reflect today’s comprehensive component-to-system-level view,” said Stanton Rak, Ph.D., co-chair of the IPC APEX EXPO Technical Conference Program Committee. “We’re strongly encouraging technologists interested in presenting to provide an early indication of interest, by July 31. Doing so, could put prospective speakers in a lead position for session slots,” added Dr. Rak. Individuals can readily communicate their early indication of interest using the abstract submission portal.”

As the industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers, and executives from all segments of the industry worldwide. Topics for technical conference papers, technical posters and professional development courses include: design and simulation; materials; advanced PCB fabrication; assembly, test and manufacturing; quality, reliability and metrology; digital manufacturing; and sustainability.

Technical Conference and Poster Submissions

For technical conference paper presentations and posters, IPC seeks abstracts that describe significant results from research experiments, highlight new techniques or materials, and/or discuss cutting-edge trends and challenges facing the electronics manufacturing industry. All submissions must be non-commercial, summarizing original and previously unpublished work covering case histories, research, and discoveries. Papers will be published in a proceedings document, and both paper and poster presentations will be delivered in person at IPC APEX EXPO 2026 in Anaheim. Deadline for early indication of interest is July 31, 2025; with technical paper abstracts due September 12, 2025.                                       

All posters will be displayed on the exhibit floor, with dedicated poster networking sessions for increased visibility. Authors of posters selected for the conference will receive further guidance on formatting, printing, and displaying posters. The deadline for technical poster abstracts is December 1, 2025.

To recognize exceptional achievement, the TPC will select the top qualifying papers and one top poster for awards. Awards include “Best of Conference,” “NextGen Best Paper,” “Best Student Research Paper,” and “Best Technical Poster.”

Professional Development Submissions

For professional development courses, IPC seeks abstracts for three-hour sessions of live instruction covering all aspects of electronics manufacturing. Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours). Honoraria and travel expense stipends are offered to professional development instructors. Professional development course abstracts are due September 19, 2025.

To submit an abstract, visit www.ipcapexexpo.org/event-info/call-participation. For more information on IPC APEX EXPO 2026, visit www.ipcapexexpo.org.