Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor

04/16/2025 | Andy Shaughnessy, Design007
The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.

IPC APEX EXPO 2025 Review: The New Normal Looks Like the Old Normal

04/16/2025 | Nolan Johnson, SMT007 Magazine
My IPC APEX EXPO, my days are filled with either talking or listening from sunup to sundown. I get to answer questions of some of the brightest minds in the business, while also listening and synthesizing what they’re sharing with me about the current and future state of the industry. Here are five observations based on the conversations.

Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation

04/17/2025 | Real Time with...IPC APEX EXPO
With a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.

YINCAE to Showcase Cutting-Edge Solutions at SEMICON Southeast Asia 2025

04/16/2025 | YINCAE
YINCAE Advanced Materials, a leading provider of innovative solutions for the semiconductor and microelectronics industries, is proud to announce its participation in SEMICON Southeast Asia 2025.

Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in