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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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IEC Collaborates with Supply Partners at IPC APEX EXPO 2025
January 29, 2025 | IECEstimated reading time: Less than a minute
In keeping with its company's Supply Chain Motto of Collaboration – Innovation – Quality – Dedication, International Electronic Components, Inc. is excited to announce its collaboration with five other companies at the upcoming IPC APEX EXPO 2025.
IEC will be sharing a booth (#3938) with the following Supply Partners: Pluritec, Eternal Technology Corporation, RBP Chemical Technology, Inc., Sigma-Mecer, and SUSS MicroTec.
Suggested Items
Jabil Announces Expansion into Gujarat
03/06/2025 | JabilJabil Inc., a global leader in engineering, supply chain, and manufacturing solutions, announced that it will open a new factory in Gujarat, its second in the country.
Jaltek Joins Midlands Aerospace Alliance
03/06/2025 | JaltekJaltek are delighted to officially announce that they have joined the Midlands Aerospace Alliance (MAA). The MAA which was formed in 2003 to support and represent the aerospace industry across the Midlands region, now represents one of the largest aerospace clusters in the world and is one of the strongest advocates for both the aerospace industry and the Midlands region.
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
03/05/2025 | Marcy LaRont, I-Connect007It was a cool and sunny morning as I headed out to the IMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. IMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.
W. Gessmann Showcases Range of Innovative AMR-Solutions at LogiMAT 2025
03/05/2025 | W. Gessmann GmbHThe international trade fair LogiMAT opens its doors in Stuttgart in March 2025, showcasing innovations in intralogistics and process management. W. Gessmann GmbH will present cutting-edge solutions for the intelligent use of AMRs and cobots in industrial intralogistics and workshops at Stand 8D65.
U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B
03/05/2025 | TrendForceTrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion.