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Geopolitics Reshapes the Global PCB Landscape as Trump 2.0 Looms
February 6, 2025 | TPCAEstimated reading time: 1 minute
The global PCB industry is undergoing a period of significant transformation driven by geopolitical shifts, protectionism, and supply chain restructuring. The US-China trade war has intensified, prompting companies to diversify manufacturing and navigate a complex landscape. The US PCB market, valued at $3.98 billion in 2024, is experiencing growth driven by defense, aerospace, and data center demands. Policies like the National Defense Authorization Act and the Chips and Science Act are fueling domestic production, with companies like TTM investing in US-based manufacturing. However, US production capacity remains limited, relying heavily on imports from Taiwan and China.
In Europe, the PCB market faces challenges from high labor and energy costs, exacerbated by the Russia-Ukraine war. The EU's FOUCSING initiative aims to establish a robust, independent supply chain for high-end PCBs in space and industrial sectors. India's PCB market, while small, is attracting foreign investment due to government incentives. However, infrastructure bottlenecks, unstable power supply, and talent shortages hinder growth.
Southeast Asia is emerging as a key hub for PCB manufacturing, with Thailand poised to become the region's largest producer. Vietnam, a key electronics manufacturing center, is also attracting significant investment. Malaysia, a leader in semiconductor packaging, is attracting investments in substrate manufacturing.
The Trump 2.0 era is expected to intensify geopolitical pressure, with potential for stricter export controls and increased tariffs. This will further complicate global supply chains and impact the competitive landscape for PCB manufacturers. The future of the global PCB industry will be characterized by regional competition and cooperation, with companies navigating complex geopolitical and economic factors.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.