Nolan’s Notes: The Interconnectedness of a Global Supply Chain
SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
February 6, 2025 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026. Designed to enhance the reliability and sustainability of high-temperature electronic assemblies, this reworkable edgebond addresses key industry challenges - rising material costs, operational complexity, and the push for more sustainable manufacturing.
Engineered to meet the demands of advanced electronic applications, ALPHA HiTech CF31-4026 is a game-changer for manufacturers looking to enhance product reliability while reducing material waste and lowering overall costs. Ideal for high-reliability applications in automotive electronics and high-performance computing, this solution ensures components endure extreme conditions without compromise.
“High-reliability electronics require robust solutions that not only perform under extreme temperatures but also support sustainable manufacturing practices,” said Tiang Chuan Hng, Global Product Manager for Polymer Reinforcement Adhesives. “ALPHA HiTech CF31-4026 provides exactly that. Its reworkable nature enables manufacturers to rework components without compromising the integrity of the assembly, promoting both cost-effectiveness and sustainability.”
A Breakthrough for Advanced Electronics Assembly
Electronic devices are becoming increasingly complex, with manufacturers facing significant challenges in ensuring product reliability, particularly in demanding environments. ALPHA HiTech CF31-4026 rises to meet these challenges by delivering exceptional thermal cycling performance, improved adhesion, and superior board-level reliability.
With its innovative reworkable design, ALPHA HiTech CF31-4026 provides manufacturers with greater flexibility. It allows for component removal at lower temperatures, starting from 185°C, enabling quick rework and reducing material waste. This makes it an ideal solution for advanced manufacturing applications where both process efficiency and sustainability are integral.
Key Features:
- Thermal performance: High Tg and low CTE deliver superior thermal cycling durability.
- Reworkable design: Reduces total cost of ownership and supports high-yield manufacturing.
- Exceptional bonding: Provides strong adhesion to PCBs, ensuring reliability in critical applications.
- Slump resistance: Maintains component integrity in dense PCB designs.
Manufacturers seeking to optimize the performance of their high-reliability applications can benefit from ALPHA HiTech CF31-4026’s innovative design, which ensures reliability under the most demanding conditions while also addressing critical sustainability concerns. This next-generation edgebond is set to redefine how manufacturers approach board-level reliability and process efficiency in high-performance electronics.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ViTrox Unveils Smart 3D AOI Solutions, Pioneering Dual-Sided Inspection and Robotic Vision Solutions for Back-end Assembly Processes
08/04/2025 | ViTroxViTrox, which strives to be the World’s Most Trusted Technology Company, proudly announces the launch of its new-generation innovations in Automated Optical Inspection (AOI) technology for back-end assembly processes.
Transition Automation to Debut Sliding Paste Retainers at SMTA International
08/04/2025 | Transition Automation (TA)Transition Automation, Inc. (TA) will exhibit a new Paste Retainer option in booth 2947 at the SMTA International 2025, taking place from Oct. 21-23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL.
August 2025 SMT007 Magazine: Supply Chain Strategies
08/04/2025 | I-Connect007 Editorial TeamBelieve it or not, how you manage your supply chain has a noticeable impact on how your brand is perceived. In this issue of SMT007 Magazine, we explore the connection between supply chain practices and brand perception—and what you can do to strengthen it.
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.