-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
WISE Partners with TTM Technologies for Syracuse uHDI Manufacturing Facility
March 4, 2025 | TTM Technologies, Inc.Estimated reading time: 1 minute
TTM Technologies (“TTM”) has selected WISE as a key partner and exclusive supplier of horizontal wet process machines for its new ultra-high-density interconnect (“uHDI”) PCB manufacturing facility in Syracuse, NY.
This cutting-edge facility, adjacent to TTM’s existing campus, represents a major investment in North American high-tech manufacturing. With a projected capital investment of $100-$130 million, the project will generate approximately 400 skilled jobs in manufacturing and engineering.
WISE will provide 15 advanced wet and mechanical process machines, ensuring optimized PCB production and reinforcing its long-standing partnership with TTM. WISE’s strong presence in the U.S., supported by its trusted partners Technica USA and Photo Chemical Systems, played a crucial role in this agreement.
In addition to providing state-of-the-art equipment, WISE offers outstanding support through two strategically stocked spare parts inventories in the USA territory and a team of 10 factory-trained technicians across the U.S. This strong service network ensures fast response times and dependable maintenance for TTM’s operations.
Phil Titterton, Executive Vice President and Chief Operating Officer of TTM Technologies, stated, “WISE’s expertise and strong U.S. support system make them a key partner in achieving our manufacturing goals.”
Massimo Passerini, Chief Executive Officer of WISE, added, “We are proud to contribute to TTM’s growth with our cutting-edge technology and dedicated service network.”
This partnership strengthens domestic PCB production, advancing high-tech manufacturing and reinforcing WISE’s commitment to excellence in the U.S. market.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.