The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Four Industry Leaders Receive IPC President’s Award at IPC APEX EXPO 2025
March 21, 2025 | IPCEstimated reading time: 2 minutes
In recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, four individuals were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, California, on March 18, 2025. Recipients were Xaver Feiner, Zollner Elektronik AG; Thomas Marktscheffel, ASMTPT GmbH; Barry Matties, IPC Publishing Group/I-Connect007; and Cathy Hanlin, Precision Manufacturing Company Inc.
Xaver Feiner is an active member of the IPC Europe Advocacy Group, where he dedicates his time to advancing the position of the electronics industry and the EMS sector across Europe. He has testified before the European Commission to support Europe’s EMS industry. He is also active in IPC’s EMS Leadership Summit, working closely with other EMS leaders to bring improvements and innovation to the manufacturing process.
Thomas Marktscheffel shares his expertise with IPC as a member and leader of several committees and is a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852. Marktscheffel has been involved with IPC standards development since 2015 when he joined the IPC-1782 A-team. He is active on A-teams for IPC-2591, IPC-HERMES-9852, IPC-2551, IPC-2552, and IPC-2553, with the overarching goal of providing standards for Factory of the Future. Currently, Marktscheffel is chair of the IPC 2-10 committee, co-chair of the IPC-2591 CFX Task Group, and chair of several A-teams.
Barry Matties is a leading force in publishing content about the electronics industry. I-Connect007 is the leading online media source for original electronics manufacturing supply chain content. I-Connect007 publishes multiple magazines, newsletters, books, webinars, podcasts, and real-time event coverage. For the past several years, Matties and I-Connect007 have been a valuable media partner for IPC APEX EXPO, dedicating entire issues of its trade magazines to covering the show. During APEX EXPO, I-Connect007 conducts interviews with dozens of industry leaders and multiple IPC staff and publishes them on the RealTime with... IPC APEX EXPO platform. Check out this year's content here.
A posthumous President’s Award was presented to valued industry member, Cathy Hanlin, with Precision Manufacturing Company, Inc. Hanlin was a valued IPC/WHMA committee member whose extensive contributions to standards development are well known. She held leadership roles on 7-31F: IPC WHMA-A-620 Task Group, 7-31FT: IPC WHMA-A-620 Training Committee, 7-31FT-AT: Training Wheelz, and 5-22A- Blue Hedgehog A-Teams.
“The leadership and expertise of Xaver, Thomas, Barry and Cathy have been indispensable to our industry,” said John W. Mitchell, IPC president and CEO. “We were proud to show our appreciation for their significant contributions to IPC and the global electronics industry by presenting them with the IPC President’s Award.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.