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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Real Time with... IPC APEX EXPO 2025: Revolutionizing PCB Manufacturing with Laser Technology from MKS' ESI
April 16, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute

In this interview, Barry Matties speaks with Casey Krueger from MKS' ESI. MKS' ESI focuses on laser-based micro machining for PCBs, especially in HDI and IC substrates. The Geode CO2 drilling system, launched in 2019, uses AOD technology to transform the market. Trends show a shift toward smaller vias for advanced packaging, with laser drilling concentrated in Asia. North America sees rising investments in laser tech, prioritizing quality, productivity, and energy efficiency, while AI integration boosts MKS's operations.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
IEEE Study Shows Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics
07/22/2025 | PRNewswireMulti-wavelength light sources are required for optical transceivers to increase data. However, scaling the laser array size increases thermal crosstalk, which may affect laser efficiency and reliability.
indie’s LXM-U Laser Powers Next-Gen Quantum Technologies with Ultra-Low Noise Performance
07/14/2025 | indie Semiconductorindie, an automotive solutions innovator, is rapidly gaining industry adoption in its photonics portfolio, with indie’s latest ultra-low noise LXM-U lasers enabling next-generation quantum applications by delivering industry-leading frequency stability and integration flexibility.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).