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Call for Abstracts for Third Pan-European Electronics Design Conference

04/27/2026 | Global Electronics Association
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

04/27/2026 | Nolan Johnson, I-Connect007
This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

Sygaldry Raises $139M to Build Quantum Computers for AI

04/22/2026 | Sygaldry
Sygaldry Technologies, Inc. announced that it has raised $139M in Series A and Seed financing to build quantum-accelerated AI servers.

New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains

04/22/2026 | I-Connect007 Editorial Team
A new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.

Intel, Dell Technologies and Nokia Redefine UPF Deployment at the Far Edge

04/21/2026 | Intel
Dell PowerEdge XR8000 with Intel® Xeon™ 6 SoC delivers high-performance UPF compute to rugged, space‑ and power‑constrained 5G edge environments.
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