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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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SCHMID Group Wins Major Order for Wet-Process Equipment for AI & HPC Infrastructure
March 11, 2026 | SCHMID GroupEstimated reading time: 2 minutes
SCHMID Group, a leading global supplier of advanced wet process equipment for the electronics manufacturing industry, has secured a lower two-digit million-USD purchase order from a major Asian high-end PCB manufacturer for a new HDI multilayer production line. The systems will support the manufacturing of next-generation AI server boards and high-performance computing (HPC) platforms, one of the fastest-growing segments of the electronics industry.
The customer is a leading high-technology PCB manufacturer in China with strong exposure to global hyperscale and data center infrastructure markets. The order covers multiple wet process systems designed for high-layer-count HDI multilayer boards, addressing the increasing complexity and reliability requirements of AI and HPC hardware.
Driven by the rapid expansion of artificial intelligence infrastructure, next-generation server boards require higher layer counts, tighter structures, and significantly improved yield stability. This trend is creating strong demand for highly controlled wet processing technologies capable of delivering consistent quality, high throughput, and superior process stability at industrial scale.
SCHMID’s advanced wet processing InfinityLine H+ and InfinityLine V+ platforms are working horses, specifically engineered to meet these requirements, enabling manufacturers to reliably produce high-density multilayer server-boards used in AI accelerators, data center networking hardware, and HPC systems.
Executive Statement – Roland Rettenmeier, Chief Sales Officer, SCHMID Group
“The explosive growth of artificial intelligence infrastructure is fundamentally transforming the global PCB and advanced electronics manufacturing landscape. AI server boards and HPC platforms are pushing HDI multilayer technology to new limits in terms of layer count, precision, and reliability.
With this significant order, SCHMID once again demonstrates its strong positioning as a key equipment partner for leading PCB manufacturers addressing these demanding markets. Our highly stable, high-quality wet process equipment solutions InfinityLine H+ and InfinityLine V+ enable our customers to scale production while maintaining the process control and yield performance required for next-generation computing infrastructure.”
SCHMID has built a strong reputation in the global high-end PCB and substrate industry for delivering robust, high-precision wet processing equipment that combines process stability, high throughput, and superior production quality. These capabilities are increasingly critical as the industry scales manufacturing capacity for AI data centers, advanced networking hardware, and high-performance computing systems.
The newly ordered equipment will be installed in the customer’s next-generation production facility, supporting volume manufacturing for global technology leaders operating in the AI and HPC ecosystem.
With demand for AI infrastructure accelerating worldwide, SCHMID continues to strengthen its role as a technology partner enabling the manufacturing backbone of the digital and AI-driven economy.
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Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.