-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Fein-Lines: Copper Dissolution Interview, Part III
August 15, 2008 | Dan Feinberg, FeinLine Associates, Inc.Estimated reading time: Less than a minute
Dan Feinberg concludes his interview with Michael Carano, Global Business Development Manager of Cleveland, Ohio-based OMG Electronic Chemicals, tackling the topic of copper dissolution with lead-free solder--an issue that is certainly not new to the industry.Listen to "Fein-Lines: Copper Dissolution Interview, Part III" here.