-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
DesignCon Best Paper: Practical Analysis of Backplane Vias
April 8, 2009 |Estimated reading time: Less than a minute
Accurate, verified models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper, which won a Best Paper Award at DesignCon 2009, describes the methodology of using measurements on a test vehicle to build a high-bandwidth, scalable model of long vias that includes the through and stub effects which can be used for system simulation. This simple model also provides valuable insight into the root cause of performance limits and how to overcome them. Authors are Eric Bogatin, Bogatin Enterprises; Lambert Simonovich, Nortel; and Sanjeev Gupta and Mike Resso, Agilent Technologies.
Click here to read.