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Trouble in Your Tank: At 40 GHz, Everything Matters, Part 1

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The electronics industry supply chain is moving very quickly with the explosion of AI servers, high-performance computing, ADAS, quantum computing, and 5G/6G. Signal integrity is under scrutiny in an entirely new role. With many factors influencing signal integrity, one area that contributes to signal distortion at high frequencies is the PCB’s final finish layer deposits. Frequencies above 40 GHz are susceptible to such distortions, and data transfer rates of 224 GB/s are driving changes in PCBs and IC substrates.

Real Time with... IPC APEX EXPO 2025: Uyemura—Inside the Specialty Chemicals Market

04/03/2025 | Real Time with...IPC APEX EXPO
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Uyemura Announces Six Sigma Graduates

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Dr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.

Gold as a Key Component in PCBs and IC Substrates

03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' Atotech
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.

Marcy's Musings: The Golden Touch?

03/18/2025 | Marcy LaRont -- Column: Marcy's Musings
Corrosion, adhesion, bonding—the comprehensive issue of surface finish plating is primary for PCB manufacturers and their assembly counterparts. Gold is the standard for many applications, but it is expensive and has its limits. This issue of PCB007 Magazine leads with a deep dive into the various iterations of gold plating by the engineering team at MKS Atotech.
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