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Heraeus CMD to Showcase Lead-free Solutions
July 22, 2005 |Estimated reading time: Less than a minute
WEST CONSHOHOCKEN, Pa. — At the upcoming Assembly Technology Expo exhibition, to be held September 27-29 in Rosemont, Ill., Heraeus' Circuit Materials Division (CMD) will be focusing on its capabilities to help the semiconductor and SMT industries transition to lead-free assembly processes. As well as its catalog of lead-free pastes and complementary fluxes, Heraeus will also be showing its new F10B Series no-clean solder pastes, the latest in the Heraeus line of high-quality solder pastes, tack fluxes and SMT adhesives. Also on display will be the full line of fluxes for reworking and solder-ball attachment for no-clean and water-soluble applications.