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NPL Leads Project to Investigate Solder Joint Reliability During Transition Period to Lead-free
March 12, 2004 |Estimated reading time: 1 minute
UK — During the run-up to the changeover to lead-free solders by July 2006, a number of end-users have expressed concerns about the reliability of soldered joints formed by mixtures of tin-lead (SnPb) and lead-free materials.
These will arise when lead-free components are soldered using SnPb alloys, something already happening in many production lines, and later when SnPb components are soldered with LF alloys. This latter issue may be a significant problem for companies that have had to invest in lifetime purchase of components. Several workers have already published information, which suggests that small levels of Pb contamination in lead-free joints can significantly reduce joint performance.
Many of those concerned end-users approached NPL to assist with clarification of any reliability issues during the transition period. A consortium of 16 contributing companies was formed, and a work program agreed to. The work will cover the following areas:
- Reliability assessment of lead-free joints to SnPb components
- Reliability assessment of SnPb joints to lead-free components
- Evaluation of hot-peel strength of Pb-contaminated lead-free joints
- Applicability of Pb indicator kits for paints for recognition of Pb-containing components
The work, lead by Martin Wickham, is already underway and results are expected in the next year.
Participating partners include:
- Aeroflex International Ltd
- AMS Space UK
- BAE SYSTEMS (Operations) Ltd.
- Celestica Ltd.
- Department of Trade & Industry
- Dolby Laboratories Inc.
- Eurotherm Ltd.
- Goodrich Engine Control Systems
- Hansatech Group
- National Physical Laboratory
- Robert Bosch GmbH
- Rolls Royce Naval Marine
- TRW Automotive
- Thales Missile Electronics Ltd.
For more information, contact National Physical Laboratory at www.npl.co.uk.