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Flexible, In-line Technology for Commercial Wafer Level Processing
August 26, 2002 |Estimated reading time: Less than a minute
Weymouth, UK -- Advanced packages such as chip scale package (CSP) and system in package (SiP) offer the electrical performance and small outline required to enable future generations of pervasive electronic products. This article explains how back end packaging processes and technology must become more flexible -- and better suited to in-line deployment -- for manufacturers to produce these packages at commercial prices.
(August 27, 2002) West Warwick, R.I. and Allen, Texas -- Advanced Interconnections Corp. has awarded its 2001 Distributor of the Year award for the Western Region to Prime Distributing Co.