-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
EIPC Announces European Supply Chain Convention 2006
July 4, 2006 |Estimated reading time: 1 minute
The European Institute of Printed Circuits (EIPC) is proud to announce a-one-of-a-kind event, the European Supply Chain Convention 2006 (ESCC2006), which will bring global OEM, ODM, EMS, PCB makers and industry suppliers together in Koelnmesse, Cologne, Germany, on October 4 and 5, 2006.
Featuring conference programs, which will highlight joint sessions of keynote addresses by world-renowned European electronics executives, ESCC2006 will offer a number of dynamic marketing opportunities including tabletop exhibits, hospitality suites, sponsorships, and multimedia advertising. The two-day convention is scheduled to offer the best educational program for delegates while providing ample networking and entertainment opportunities.
Who should attend?<?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
Engineers and decision-makers in the field of OEMs, EMS, assembly, and PCB fabricators as well as board and system designers at all levels are invited to participate. Circuit board designers, looking into more cost-effective solutions and miniaturisation, will learn about the developing trends in different applications. Board fabricators and development engineers will gain background information that will help to focus on more profitable products. Specialists and marketing managers will gain additional background data to focus on advanced PCB applications. OEMs will get a better understanding on how to get prepared for the next generation of electronic products.
For more information, contact Sonja Derhaag at sderhaag@eipc.org or visit www.eipc.org.