First Report: IPC Standards Committee

Estimated reading time: 4 minutes

These standards committee reports from IPC's Fall Standards Development Committee Meetings (co-located with SMTAI) have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.Assembly and Joining

The 5-21a IPC-7070 Task Group is developing IPC-7070, Component Mounting – Issues and Recommendations, which will supersede IPC-CM-770. Some requirements from IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard, have been moved into the new document and this will be an opportunity to explain the dos and don’ts of robust component mounting. The committee reviewed an outline of IPC-7070 and determined the need for the land pattern document to link closely to this new proposal. A simplification of component description was established and the new work will combine the two documents, each with their own focus, but be closely related.

The 5-21g Flip Chip Mounting Task Group is preparing revision A to IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. The revision will include information on new semiconductor packaging concepts of 2.5 and 3D package configurations. A draft outline is being prepared for the revision that reorganizes the various chapters.

The 5-21jnd Solder Paste Task group released IPC-7527, Solder Paste Printing Acceptance Guide, for publication.

The 5-21k IPC-SM-817 SMT Adhesive Task group has re-formed and is opening IPC-SM-817, General Requirements for Dielectric Surface Mounting Adhesive, for revision A. This group has developed two surveys, one for adhesive manufacturers and one for adhesive users, to determine if any of the tests within the are obsolete or if other tests should be added.

The 5-22a J-STD-001 Task Group reviewed nearly 75 open action items and comments on J-STD-001F, Requirements for Soldered Electrical and Electronic Assemfffblies. This task group met a second day to resolve comments on criteria common to both J-STD-001 and IPC-A-610, Acceptability for Electronic Assemblies.

The 5-22arr J-STD-001/Conformal Coating Material & Application Industry Assessment Working Group discussed the current status of round robin testing and made a number of revisions to measurement protocols.

The 5-22h Thermal Profiling Guide Task Group held its first meeting and focused on revision A of IPC-7530, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave). The group discussed: missing definitions, modification of what thermal profiles should be covered, including special applications of laser, inductive soldering, hot bar, and hot belt. The group also discussed development guidelines, calibration, process control, and process guidelines.

The 5-23a Printed Circuit Board Solderability Specifications Task Group completed work on J-STD-003C, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components revision. This document was published in September 2013.

The 5-23b Component and Wire Solderability Specifications Task Group revised design of experiment (DOE) activity on solder paste aperture requirements for Test Method S.

The 5-24a Flux Specifications Task Group is continuing to review and revise all applicable test methods.

The 5-24b Solder Paste Task Group began review of all test methods originating with the group and discussed revising IPC-HDBK-005, Guide to Solder Paste Assessment.

The 5-24c Solder Alloy Task Group published J-STD-006C, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications in July 2013. The task group is addressing the addition of two new solder alloys to the appropriate sections of the document and reviewing changes/corrections which have been brought to the committee’s attention. The goal is to publish an amendment to the document.

Cleaning and Coating

The 5-31g Stencil Cleaning Handbook Task Group is working on revision A of IPC-7526, Stencil and Misprinted Board Cleaning Handbook.

The 5-31j Cleaning Compatibility Task Group decided to develop a guideline document for electronic and electrical component part testing that includes static and dynamic cleaning exposure tests to determine resistance to deleterious effects of cleaning agents.

The 5-32a Ion Chromatography/Ionic Conductivity Task Group is developing a component method. This test method could potentially be used as a secondary approach to evaluating counterfeit parts.

The 5-32b Surface Insulation Resistance Task Group discussed the development of an SIR test pattern library. This group received a report on the updated IPC-B-52 test board.

The 5-32e Conductive Anodic Filament (CAF) Task Group addressed revision B of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing).  Changes in sections 8, 9 and 12 were agreed to in what is now Draft 11 of the user guide.  The group discussed other CAF test techniques being used in industry.

The 5-33a Conformal Coating Task Group reviewed IPC-CC-830, Qualification and Performance of Electrical Insulation Compounds for Printed Board Assemblies, This group is pursuing a C revision rather than an amendment. Revisions will include a test method for adhesion, address issues with testing and documentation on insulation testing results of 500 megohms vs. 5000 megohms, and the possible addition of a new generic type of conformal coating.

The 5-33c Conformal Coating Task Group published IPC-HDBK-830A, Guidelines for Design, Selection and Application of Conformal Coatings in September 2013. Task group members will be transitioned to the 5-33a Working Group and will undertake the support of the conformal coating sections of IPC-A-610 and J-STD-001. In addition, the group will address the evaluation of conformal coating for use environments.

The 5-33f Potting and Encapsulation Task Group published IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly in July 2013.

Product Assurance

The 7-31j Requirements for Structural Enclosure Task Group published the IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures in September 2013. The task group reviewed and resolved comments from the second ballot of IPC-HDBK-630, Structural Enclosure Guidelines Handbook. The handbook will be going back out to the committee for third ballot with the goal to publish before the end of 2013.