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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
June 3, 2015 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes

It seems that flex circuit technology is definitely coming into its own. The market for flex circuitry has always been growing, but now it is rapidly accelerating, with new technologies and new applications in the news nearly every day. Flex is not just in your laptop and camera anymore, it is in your car, in space, and on your body. In other words, flex is everywhere.
We originally intended this issue to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.
Our cover story from OM Group discusses the processing of flex materials using a stress-free plating technology for both flex and rigid-flex materials.
Then, Dr. Joan Vrtis of Multek gives a great market overview of that relatively new industry most often called ‘wearables.’ She points out that wearables are not new, but when combined with electronics, this industry is only limited by the imagination, as the technology to make it happen is rapidly evolving.
Looking at another flex industry segment (flex segmented!), Maarten Cauwe and co-authors from imec pull our interest in a different direction as they explore two technologies for flexible and stretchable circuits in space applications.
So back to the beginning: Two articles discuss new materials to help make some of this happen. Panasonic’s Yoshioka et al., present a high-performance substrate for stretchable electronics, while Dupont’s Sidney Cox discusses a new flex material for high-temperature
applications.
Also on the topic of the processing of flex materials, Patrick Riechel of ESI reviews three technologies for microvia drilling and cutting. Rounding out the processing topic is columnist Todd Kolmodin with a brief overview on testing flex circuits.
This month is a perfect time to introduce our two newest columnists, who will become regular contributors to our Flex007 Weekly Newsletter that publishes every Thursday. As her first subject, Tara Dunn of Omni PCB chose “Flex-to-Fit”—another flex industry subset that is only limited by the imagination.
And last but not least, Dave Becker of All Flex presents his summary of wearable technology. There’s a lot going on in flexible, stretchable, wearable technology and there is much to learn!
Suggested Items
Horizon Sales Celebrates 10 Years of Exceptional Service by Sales Leader David Smith
07/02/2025 | Horizon SalesHorizon Sales, a premier manufacturers’ representative and distributor for the electronics assembly industry, is proud to announce that David Smith is celebrating 10 years with the company this month.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Reflections and Priorities: An Update to I-Connect007 Readers
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The Knowledge Base: Building the Workforce of Tomorrow With EMAC
06/24/2025 | Mike Konrad -- Column: The Knowledge BaseAs the electronics manufacturing industry races to meet rising global demand and technological complexity, the need for a highly skilled, future-ready workforce has never been greater. At the forefront of addressing this challenge is The Electronics Manufacturing & Assembly Collaborative (EMAC)—a national initiative dedicated to strengthening the talent pipeline through strategic collaboration with SMTA, education, and government stakeholders.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.