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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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EIPC Summer Conference Just Around the Corner
June 9, 2015 | EIPCEstimated reading time: Less than a minute
It's less than two weeks away before the European Institute of Printed Circuits (EIPC) Summer Conference. To be held in Berlin from June 18 to 19, this year's event will include a guided tour of the Fraunhofer Institute.
The conference will have an iconic selection of speakers, including Alun Morgan, EIPC Chairman, who will present a market outlook on behalf of Walt Custer who is unable to join this year, as well as luminaries as Dr. Ivan Ndip, Lars Böttcher and Dr. Olaf Wittler, all from Fraunhofer IZM. Walter Huck of IEC and Martyn Gaudion of Polar Instruments will also be present, so as speakers from AT&S, Thales, Cimulec, Atotech, Taiyo, Camtek, First EIE, Du Pont and Cambridge Nanotherm, to name a few.
Download the conference registration form by clicking here.
For the detailed conference programme, click here.
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