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APCT Chooses atg Flying Probe for High-speed Test and Automation
June 29, 2015 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute
atg Luther & Maelzer GmbH confirms the installation of one of their A5a automatic high-speed bare board flying probe test systems. The atg A5a 8 head, double-sided, auto-load/unload system for true “lights-out” operation has been ordered by APCT of Santa Clara, California.
APCT is a leading manufacturer of high reliability rigid printed circuit boards. Located in the heart of northern California's Silicon Valley, the plant is designed to facilitate world class cycle times and support a broad range of technologies. Their corporate culture focuses on continuous improvement and strives for “best in class” in service and support. APCT is ISO9001:2008, IPC 6012 Class III certified and ITAR registered.
atg Luther & Maelzer GmbH - With more than 150 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the printed circuit board industry. We have solutions for every application regardless of product type, batch size or technology deployed. Our atg flying probe tester products are renowned for automation, speed, accuracy, versatility and ease of use, while the Luther & Maelzer universal grid tester product range is known worldwide for high throughput, repeatability, gentle handling and precision accuracy.
atg’s A5a (auto-load/unload) testers utilize 8 flying probe test heads, multiple optical recognition systems, and a wide variety of advanced, high-speed electrical test measurement techniques to electrically test all types of PCB’s for continuity and isolation. Board sizes of 24” x 18’ (or larger), with small pad/fine pitch technology can be tested quickly and easily. Special options, such as, 4-wire kelvin tests, hi-pot test, latent defect test, and others can be provided.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.