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IPC Lauds Launch of Flexible Hybrid Electronics Institute
August 31, 2015 | IPCEstimated reading time: 1 minute
On behalf of IPC – Association Connecting Electronics Industries® and an estimated 800,000 people employed in our 2,200 U.S. member facilities, we applaud the launch of the new public-private institute on flexible hybrid electronics in Mountain View, Calif. This new facility, which will contribute to America’s global competitiveness in manufacturing, is part of the new National Network for Manufacturing Innovation (NNMI), which IPC has strongly supported.
On Friday, August 28, U.S. Secretary of Defense Ashton Carter and Congressman Mike Honda announced that the Department of Defense awarded the lead role in establishing a Flexible Hybrid Electronics – Manufacturing Innovation Institute (FHE-MII) to the FlexTech Alliance. IPC has committed to join the FHE-MII, which will work on the technical and business challenges of flexible hybrid electronics, a significant area of interest to IPC members.
In recent years, IPC has been a strong supporter of the NNMI initiative. IPC played a lead role in promoting the Revitalize American Manufacturing Innovation (RAMI) Act of 2014, which authorized the NNMI and was signed into law by President Obama last December. IPC continues to urge the U.S. Congress to fully fund the NNMI, so that this advanced manufacturing network can achieve its full potential in driving and growing American innovation and jobs.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
NOTE Appoints Bahare Mackinovski Chief Sales and Marketing Officer
09/04/2025 | NOTEAs part of NOTE’s strategic focus on growth and customer value, the company is now strengthening its executive management team by appointing Bahare Mackinovski as Chief Sales and Marketing Officer.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.