Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
PhiChem Joins UL Standards Technical Panel 796 for PWB
September 17, 2015 | PhiChem CorporationEstimated reading time: 1 minute
Dr. Jin Zhang, President of PhiChem Corporation announced today that PhiChem has been accepted as a member of Underwriters Laboratories (UL) Standards Technical Panel (STP) for Printed Wiring Boards STP796, which covers standards UL746E and UL796. UL746E is the UL Standard for Polymeric Materials – Industrial Laminates, Filament Wound Tubing, Vulcanized Fiber, and Materials Used in Printed-Wiring Board, while UL796 is the Standard for Printed-Wiring Boards. An STP is made up of qualified member companies that have a common interest or stake in maintaining particular standards. These companies are entrusted to manage changes in these standards under the chairmanship of the UL.
Companies are accepted into the STP based on their status as a supplier, user, general interest group, OEM or other relevant category. An effort is made on the part of UL, to have an STP membership list is balanced, with no particular category having a numerical voting advantage. Both of the standards overseen by STP796 are pertinent to the qualification and listing of materials and boards for the printed circuit industry. PhiChem is excited to be part of the standards development process managed by this STP, and at the opportunity to make meaningful contributions to printed wiring board standards in the future.
About PhiChem
PhiChem Corporation is a leading developer, manufacturer and seller of high-performance, cost-effective materials for a wide range of manufacturing sectors, including communications, electronics and consumer products. PhiChem is one of the world’s leading suppliers of UV curable optical fiber coating materials. Its electronics product portfolio includes key materials for the semiconductor, surface-mount and printed wiring board processing. Recently, the company’s product portfolio has been further diversified to include a line of high-purity alumina materials. These materials can be used for growing Sapphire crystal to make substrates for light emitting diode (LED) and portable electronics display cover manufacturing.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.