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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Navigating the Global Materials Supply Chain: A Roundtable Discussion
December 3, 2015 | Andy Shaughnessy, I-Connect007Estimated reading time: 15 minutes
At SMTAI recently, I sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group, responsible for all non-agent activity and the supply, distribution and service centers in the U.S. and Europe; and Jack Pattie, president of Ventec USA and as such, manager of North American operations for the distribution of laminate and pre-preg. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen, head of the Germany-based company that has been producing PCBs for more than 50 years and specializes in rigid-flex and flex activities, and Bob Willis, from the National Physics Laboratory (NPL), known worldwide for measuring standards. In a wide-ranging chat, we discussed the demands and challenges of the materials supply chain and where they see their industry going in the future.
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