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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Navigating the Global Materials Supply Chain: A Roundtable Discussion
December 3, 2015 | Andy Shaughnessy, I-Connect007Estimated reading time: 15 minutes
At SMTAI recently, I sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group, responsible for all non-agent activity and the supply, distribution and service centers in the U.S. and Europe; and Jack Pattie, president of Ventec USA and as such, manager of North American operations for the distribution of laminate and pre-preg. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen, head of the Germany-based company that has been producing PCBs for more than 50 years and specializes in rigid-flex and flex activities, and Bob Willis, from the National Physics Laboratory (NPL), known worldwide for measuring standards. In a wide-ranging chat, we discussed the demands and challenges of the materials supply chain and where they see their industry going in the future.
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Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.