Largest Flexible X-Ray Detector Made with Thin Film Transistors
December 28, 2015 | PARCEstimated reading time: 2 minutes
The Flexible Electronics and Display Center (FEDC) at Arizona State University and PARC, a Xerox company, announced today that they have successfully manufactured the world's largest flexible X-ray detector prototypes using advanced thin film transistors (TFTs).
Measuring 10 diagonal inches, the device has been jointly developed at the FEDC and PARC in conjunction with the Army Research Lab (ARL) and the Defense Threat Reduction Agency (DTRA). The device will be used to advance the development of flexible X-ray detectors for use in thin, lightweight, conformable and highly rugged devices.
“This achievement is a fantastic example of how academia, industry and government can collaborate to advance key technologies and national priorities,” said Sethuraman “Panch” Panchanathan, senior vice president for Knowledge Enterprise Development at ASU. “Flexible electronics hold tremendous potential to accelerate our global competitiveness in the area of advanced manufacturing by partnering with federal agencies and industry leaders."
The TFT and PIN diode processing was done on the 470 mm by 370 mm Gen II line at the FEDC. This device showcases the center's successful scale up to GEN II, and the ability to produce sensors and displays using TFTs in standard process flows with the center’s proprietary bond/de-bond technology. These detectors are unique in that they showcase both of the flexible substrates the center uses to make devices. Some of the new detectors are on PEN (Polyethylene Naphthalate) and some are on polyimide.
“This success came from a rewarding collaboration that combines FEDC’s flexible array fabrication technology and PARC’s experience with digital x-ray systems,” said Bob Street, PARC Senior Research Fellow.
The system design and integration was done at PARC. The flexible X-ray sensor was coupled to a tablet device for control and image viewing. This system shows PARC’s capability to build user-defined prototype systems incorporating novel device physics, materials and technology. PARC has extensive experience in building large-area electronic systems, display and backplane prototypes, and organic and printed electronics.
Page 1 of 2
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.