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2015’s Most Read PCB Articles
December 31, 2015 | I-Connect007Estimated reading time: 2 minutes
EIPC Summer Conference, Berlin
The 2015 EIPC Summer Conference attracted delegates to Berlin from sixteen countries to experience 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organization.
HDPUG Demonstrates Benefits of Cooperative R&D
The High-Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
Raising a Unified Voice for an Advanced Manufacturing Economy
The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.
Characterization of PCB Material & Manufacturing Technology for High-Frequency
Concepts like Industry 4.0, Internet of Things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement— a considerable amount of data and increased data transfer rate. the aim of this paper is to develop a concept to use materials in combination with optimized pcB manufacturing processes, which allows a significant reduction of losses and increased signal quality.
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