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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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KYOCERA Circuit Solutions Announces Incorporation into KYOCERA Corporation
February 2, 2016 | Kyocera Circuit Solutions, Inc.Estimated reading time: Less than a minute

Kyocera Circuit Solutions, Inc. has announced that it will be integrated into Kyocera Corporation effective as of April 1, 2016. The purpose of this merger is to further expand related businesses by improving efficiency and enhancing the development of new products and markets through the pursuit of synergistic effects.
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