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ASC Acquires Cutting-Edge High Vacuum Plugging Machine CF 200 to Expand Via Fill Capabilities
May 12, 2025 | American Standard CircuitsEstimated reading time: 1 minute

Anaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone Circuits, has announced that the company has acquired and installed a state-of-the-art ITC Intercircuit CF 200 high vacuum plugging machine at its West Chicago manufacturing facility. This latest investment further strengthens ASC’s ongoing commitment to advanced manufacturing, precision engineering, and industry-leading process automation.
The CF 200 is a high-speed, high-accuracy machine designed specifically for epoxy via fill applications, an essential step in the fabrication of complex PCBs, including HDI, sequential lamination, and rigid-flex designs. Engineered for performance and reliability, the CF 200 offers programmable dispensing control, temperature-regulated epoxy handling, and automated cleaning cycles—making it one of the most efficient and repeatable via fill solutions on the market today.
“The CF 200 is a critical addition to our expanding technology portfolio,” said Mr. Vardya. “As more of our customers push the limits of design with advanced sequential builds and via-in-pad configurations, the demand for high-quality via fill has never been greater. This equipment allows us to meet those needs with extreme consistency, efficiency, and quality—every single time.”
Designed to handle everything from microvias to large through-holes, the CF 200 enables tighter process control, improved thermal stability, and eliminates voids and defects that can occur with manual or outdated systems. It is particularly vital in the fabrication of boards used in high-reliability markets such as aerospace, medical, and defense—markets where ASC already leads in compliance and certification.
“This is not just an equipment upgrade; it’s a strategic move,” Vardya added. “The CF 200 system dramatically enhances our capability to deliver complex, dense, multilayer boards with the precision and dependability our customers expect. It fits perfectly with our mission to continue automating key processes, reducing cycle times, and improving yields across the board.”
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New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Netomnia Selects VIAVI Remote Fiber Test System to Accelerate Network Expansion in the UK VIAVI Solutions
06/24/2025 | PRNewswireVIAVI Solutions Inc. announced that alternative network (Alt-Net) operator Netomnia has chosen VIAVI's ONMSi Remote Fiber Test System (RFTS) to simplify and accelerate network installation and ongoing maintenance as the company rapidly expands its business in the UK.
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.