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The Chemical Connection: Through-glass Vias in Glass Substrates

06/24/2025 | Don Ball -- Column: The Chemical Connection
This month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.

Boeing, Angolan Ministry of Transport Sign Memorandum of Strategic Cooperation

06/21/2025 | Boeing
Boeing and the Ministry of Transport of the Republic of Angola signed a Memorandum of Strategic Cooperation to explore initiatives aimed at advancing the Angolan aviation sector, in partnership with TAAG Angola Airlines.

Marcy's Musings: The Hole Truth—Via Integrity in an HDI World

06/17/2025 | Marcy LaRont -- Column: Marcy's Musings
This month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.

Boeing 20-Year Forecast Shows Steady Demand for Nearly 44,000 New Airplanes

06/15/2025 | Boeing
Emerging markets, with expanding middle classes, dynamic and competitive airline networks and sustained aviation investment, will play an outsized role in global air traffic growth, helping drive a need for 43,600 commercial airplanes over the next 20 years, Boeing projected.

VIAVI, Hanyang University Sign Memorandum of Understanding to Advance 6G Research

06/10/2025 | PRNewswire
VIAVI Solutions Inc. and Hanyang University, one of South Korea's leading academic institutions, today announced a Memorandum of Understanding to collaborate on AI-RAN, 5G and 6G research at the university's Beyond-G Global Innovation Center.
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