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RTX’s Collins Aerospace Upgrades Radio Altimeters to Meet FAA Standards

10/21/2026 | PRNewswire
Collins Aerospace, an RTX business, announced upgrades for its family of radio altimeters, providing business aviation operators a clear path to meet new Federal Aviation Administration (FAA) operational standards.

Honeywell Forecasts Business Aviation Growth Through 2035

10/19/2026 | Honeywell
Honeywell Aerospace published its 35th annual Global Business Aviation Outlook, forecasting continued growth in the business aviation sector over the next decade as aircraft deliveries rise, fleet sizes expand and operators increase the hours they fly their aircraft.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

3 Key Takeaways from The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness

09/22/2026 | I-Connect007
As PCB technology has evolved, the structures being evaluated become more complex. But have the methods used to determine their reliability evolved at the same pace? In The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, Bob Neves challenges some long-held assumptions about how the electronics industry evaluates PCB via structures. He draws on decades of reliability experience, and examines not only how we test, but what those tests actually tell us.

Real Time with... THECA 2026: Reliability Assessment Solutions Inc. on Smarter Electronics Testing

09/02/2026 | Real Time with... THECA
Bob Neves, CEO of Reliability Assessment Solutions Inc., examines how electronics companies can approach product reliability more realistically. Drawing on concepts from his book, The Printed Circuit Assembler’s Guide to...Via Structures: Reflow Process Survivability, Reliability, and Robustness, he describes the three Rs of via testing and reliability and stresses the importance of truly understanding the type of testing required in each specific use case. He warns that poorly aligned accelerated testing can lead to inaccurate life predictions, unnecessary over-engineering, and higher costs.
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