-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
ASC Acquires Cutting-Edge High Vacuum Plugging Machine CF 200 to Expand Via Fill Capabilities
May 12, 2025 | American Standard CircuitsEstimated reading time: 1 minute

Anaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone Circuits, has announced that the company has acquired and installed a state-of-the-art ITC Intercircuit CF 200 high vacuum plugging machine at its West Chicago manufacturing facility. This latest investment further strengthens ASC’s ongoing commitment to advanced manufacturing, precision engineering, and industry-leading process automation.
The CF 200 is a high-speed, high-accuracy machine designed specifically for epoxy via fill applications, an essential step in the fabrication of complex PCBs, including HDI, sequential lamination, and rigid-flex designs. Engineered for performance and reliability, the CF 200 offers programmable dispensing control, temperature-regulated epoxy handling, and automated cleaning cycles—making it one of the most efficient and repeatable via fill solutions on the market today.
“The CF 200 is a critical addition to our expanding technology portfolio,” said Mr. Vardya. “As more of our customers push the limits of design with advanced sequential builds and via-in-pad configurations, the demand for high-quality via fill has never been greater. This equipment allows us to meet those needs with extreme consistency, efficiency, and quality—every single time.”
Designed to handle everything from microvias to large through-holes, the CF 200 enables tighter process control, improved thermal stability, and eliminates voids and defects that can occur with manual or outdated systems. It is particularly vital in the fabrication of boards used in high-reliability markets such as aerospace, medical, and defense—markets where ASC already leads in compliance and certification.
“This is not just an equipment upgrade; it’s a strategic move,” Vardya added. “The CF 200 system dramatically enhances our capability to deliver complex, dense, multilayer boards with the precision and dependability our customers expect. It fits perfectly with our mission to continue automating key processes, reducing cycle times, and improving yields across the board.”
Suggested Items
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
Boeing, Angolan Ministry of Transport Sign Memorandum of Strategic Cooperation
06/21/2025 | BoeingBoeing and the Ministry of Transport of the Republic of Angola signed a Memorandum of Strategic Cooperation to explore initiatives aimed at advancing the Angolan aviation sector, in partnership with TAAG Angola Airlines.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.
Boeing 20-Year Forecast Shows Steady Demand for Nearly 44,000 New Airplanes
06/15/2025 | BoeingEmerging markets, with expanding middle classes, dynamic and competitive airline networks and sustained aviation investment, will play an outsized role in global air traffic growth, helping drive a need for 43,600 commercial airplanes over the next 20 years, Boeing projected.
VIAVI, Hanyang University Sign Memorandum of Understanding to Advance 6G Research
06/10/2025 | PRNewswireVIAVI Solutions Inc. and Hanyang University, one of South Korea's leading academic institutions, today announced a Memorandum of Understanding to collaborate on AI-RAN, 5G and 6G research at the university's Beyond-G Global Innovation Center.