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ASC Acquires Cutting-Edge High Vacuum Plugging Machine CF 200 to Expand Via Fill Capabilities
May 12, 2025 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone Circuits, has announced that the company has acquired and installed a state-of-the-art ITC Intercircuit CF 200 high vacuum plugging machine at its West Chicago manufacturing facility. This latest investment further strengthens ASC’s ongoing commitment to advanced manufacturing, precision engineering, and industry-leading process automation.
The CF 200 is a high-speed, high-accuracy machine designed specifically for epoxy via fill applications, an essential step in the fabrication of complex PCBs, including HDI, sequential lamination, and rigid-flex designs. Engineered for performance and reliability, the CF 200 offers programmable dispensing control, temperature-regulated epoxy handling, and automated cleaning cycles—making it one of the most efficient and repeatable via fill solutions on the market today.
“The CF 200 is a critical addition to our expanding technology portfolio,” said Mr. Vardya. “As more of our customers push the limits of design with advanced sequential builds and via-in-pad configurations, the demand for high-quality via fill has never been greater. This equipment allows us to meet those needs with extreme consistency, efficiency, and quality—every single time.”
Designed to handle everything from microvias to large through-holes, the CF 200 enables tighter process control, improved thermal stability, and eliminates voids and defects that can occur with manual or outdated systems. It is particularly vital in the fabrication of boards used in high-reliability markets such as aerospace, medical, and defense—markets where ASC already leads in compliance and certification.
“This is not just an equipment upgrade; it’s a strategic move,” Vardya added. “The CF 200 system dramatically enhances our capability to deliver complex, dense, multilayer boards with the precision and dependability our customers expect. It fits perfectly with our mission to continue automating key processes, reducing cycle times, and improving yields across the board.”
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10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
SMTA Next Gen 10 Emerging Leaders Announced
10/01/2025 | SMTAThe SMTA is proud to announce the Next Gen 10 award recipients for 2025. The program recognizes young leaders who demonstrate outstanding success in their careers and contributions to the electronics manufacturing industry.
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Beyond Design: Slaying Signal Integrity Villains
09/17/2025 | Barry Olney -- Column: Beyond DesignHigh-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.