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New Podcast Series Launches: Optimize the Interconnect

07/16/2025 | I-Connect007
I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.

Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids

07/09/2025 | Happy Holden -- Column: Happy’s Tech Talk
When we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.

The Death of the Microsection

06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.
I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.

Netomnia Selects VIAVI Remote Fiber Test System to Accelerate Network Expansion in the UK VIAVI Solutions

06/24/2025 | PRNewswire
VIAVI Solutions Inc. announced that alternative network (Alt-Net) operator Netomnia has chosen VIAVI's ONMSi Remote Fiber Test System (RFTS) to simplify and accelerate network installation and ongoing maintenance as the company rapidly expands its business in the UK.

The Chemical Connection: Through-glass Vias in Glass Substrates

06/24/2025 | Don Ball -- Column: The Chemical Connection
This month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
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