Researchers Engineer an Electronics First, Opening Door to Flexible Electronics
February 10, 2016 | University of AlbertaEstimated reading time: 3 minutes
An engineering research team at the University of Alberta has invented a new transistor that could revolutionize thin-film electronic devices.
Their findings, published in the prestigious science journal Nature Communications, could open the door to the development of flexible electronic devices with applications as wide-ranging as display technology to medical imaging and renewable energy production.
The team was exploring new uses for thin film transistors (TFT), which are most commonly found in low-power, low-frequency devices like the display screen you’re reading from now. Efforts by researchers and the consumer electronics industry to improve the performance of the transistors have been slowed by the challenges of developing new materials or slowly improving existing ones for use in traditional thin film transistor architecture, known technically as the metal oxide semiconductor field effect transistor (MOSFET).
But the U of A electrical engineering team did a run-around on the problem. Instead of developing new materials, the researchers improved performance by designing a new transistor architecture that takes advantage of a bipolar action. In other words, instead of using one type of charge carrier, as most thin film transistors do, it uses electrons and the absence of electrons (referred to as “holes”) to contribute to electrical output. Their first breakthrough was forming an ‘inversion’ hole layer in a ‘wide-bandgap’ semiconductor, which has been a great challenge in the solid-state electronics field.
Once this was achieved, “we were able to construct a unique combination of semiconductor and insulating layers that allowed us to inject “holes” at the MOS interface,” said Gem Shoute, a PhD student in the Department of Electrical and Computer Engineering who is lead author on the article. Adding holes at the interface increased the chances of an electron “tunneling” across a dielectric barrier. Through this phenomenon, a type of quantum tunnelling, “we were finally able to achieve a transistor that behaves like a bipolar transistor.”
“It’s actually the best performing [TFT] device of its kind—ever,” said materials engineering professor Ken Cadien, a co-author on the paper. “This kind of device is normally limited by the non-crystalline nature of the material that they are made of”
The dimension of the device itself can be scaled with ease in order to improve performance and keep up with the need of miniaturization. An advantage that modern TFTs lack. The transistor has power-handling capabilities at least 10 times greater than commercially produced thin film transistors.
Electrical engineering professor Doug Barlage, who is Shoute’s PhD supervisor and one of the paper’s lead authors, says his group was determined to try new approaches and break new ground. He says the team knew it could produce a high-power thin film transistor—it was just a matter of finding out how.
“Our goal was to make a thin film transistor with the highest power handling and switching speed possible. Not many people want to look into that, but the raw properties of the film indicated dramatic performance increase was within reach,” he said. “The high quality sub 30 nanometre (a human hair is 50 nanometres wide) layers of materials produced by Professor Cadien’s group enabled us to successfully try these difficult concepts”
In the end, the team took advantage of the very phenomena other researchers considered roadblocks.
“Usually tunnelling current is considered a bad thing in MOSFETs and it contributes to unnecessary loss of power, which manifests as heat,” explained Shoute. “What we’ve done is build a transistor that considers tunnelling current a benefit.”
The team has filed a provisional patent on the transistor. Shoute says the next step is to put the transistor to work “in a fully flexible medium and apply these devices to areas like biomedical imaging, or renewable energy.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
08/20/2025 | Bob Duke -- Column: Global Sourcing SpotlightIn global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.