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3D Printing of PCBs: 'Forward Thinking' Nano Dimension to Present at IPC APEX 2016
March 1, 2016 | Business WireEstimated reading time: 1 minute
Nano Dimension will be a featured presenter at IPC APEX EXPO 2016, which is taking place March 13-17 in Las Vegas. The company, which is focused on the intersection of 3D printing and electronics, is sure to be a big draw at the premier event for the printed circuit board (PCB) and electronics manufacturing industry.
Simon Fried, Nano Dimension’s co-founder and chief business officer, will present, “What happens when 3D printing and conductive inks converge?” at 10am and 4:30pm on Wednesday, March 16.
The theme of IPC APEX EXPO 2016 is “Forward Thinking for Tomorrow’s Technology,” and it is a perfect fit for Nano Dimension. In recent months, the company has created enormous excitement for its DragonFly 2020 3D Printer, which is the world’s first desktop-sized 3D printer designed specifically for the production of professional multilayer PCBs.
The capability of rapidly producing functional multilayer PCB prototypes using 3D printing is new to the printed electronics design and manufacturing industry. Nano Dimension’s DragonFly 2020 3D Printer will allow users to build functional, multilayer circuit board prototypes in-house – in a matter of hours.
Nano Dimension is meeting an important need in the electronics industry for faster and more efficient innovation. The company combines patented 3D printing hardware, advanced software and advanced nanoparticle inks, offering a complete solution for professional printed electronics.
About Nano Dimension
Nano Dimension, founded in 2012, focuses on the development of advanced 3D printed electronics systems. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multilayer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
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