Top Seven Vendors in the Global Semiconductor Packaging Materials Market
April 25, 2016 | Business WireEstimated reading time: 3 minutes
Technavio has announced the top seven leading vendors in their recent global semiconductor packaging materials market report. This research report also lists 36 other prominent vendors that are expected to impact the market during the forecast period.
Competitive vendor landscape
The global semiconductor packaging materials market is highly fragmented. There are many diversified multinational, regional, and local vendors in the market. The majority of the market is concentrated in APAC. “The local players have raised the bar by offering innovative solutions at a lower price than the international players by backtracking and re-engineering the processes used by them. This is leading to price wars and forcing bigger players to introduce innovative solutions,” says Sharan Raj, a lead analyst at Technavio for packaging.
The smaller local vendors compete in terms of cost as it is difficult for them to compete with international vendors in terms of quality, features, and range of offerings. However, as there is an increase in automated line production facilities worldwide, vendors are finding that there is huge scope for innovation in material handling. It is expected that the international players will grow inorganically during the forecast period by acquiring regional or local players.
Top seven semiconductor packaging materials market vendors
Amkor Technology
Amkor Technology was founded in 1968 and is headquartered in Tempe, Arizona, US. The company offers advanced semiconductor assembly and test services. The company also provides a wide range of services, which includes package design and development, wafer bumping and redistribution services, wafer probe, assembly, and final test. For FY2015, the company reported revenue of USD 2.88 billion.
DuPont
DuPont was founded in 1802 and is headquartered in Wilmington, Delaware, US. The company provides a wide range of products for the agriculture, automotive, building and construction, chemicals, electronics, food and beverage, energy, public sector and government, healthcare and medical, marine, and packaging industry. For the FY2015, the company generated revenue of USD 25.13 million.
Henkel
Henkel was founded in 1876 and is headquartered in Düsseldorf, Germany. It specializes in laundry and home care, adhesive technology, and beauty care businesses worldwide. Some of its brands include Persil, Schwarzkopf, and Loctite. It has more than 8,150 patents worldwide. For the FY2015, the company reported a revenue of USD 20.07 billion.
Hitachi Chemical
Hitachi Chemicals was founded in 1962 and is headquartered in Tokyo, Japan. The company produces and distributes electronic-related products and advanced performance products. Its product portfolio includes printed wiring boards and related products, semiconductor and display related materials, carbon and ceramic, functional films, and automotive products. For the FY2015, the company reported a revenue of USD 4.38 billion.
Page 1 of 2
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.