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Frontline Launches InCAM Flex
May 18, 2016 | Frontline PCB SolutionsEstimated reading time: 2 minutes

Frontline PCB Solutions, an Orbotech-Mentor Graphics company, today announced the launch of InCAM Flex, a dedicated new CAM solution for flex and rigid-flex PCB makers. InCAM Flex combines analysis and editing capabilities with automatic production data optimization to perform high-precision CAM tooling for flex and rigid-flex manufacturing, helping manufacturers meet the challenges of flex PCB production by maximizing their capabilities and flex processes.
“Flex circuit makers are looking to expand their capacity and enhance their processes to meet the increasing demands and challenges of a rapidly growing flex PCB market,” said Yovav Sameah, president, Frontline PCB Solutions. “Delivering InCAM Flex to flex manufacturers enables our customers to get the best out of their flex production processes and is the next phase in our strategy to bring our world-leading InCAM capabilities to the entire PCB market.”
Frontline PCB Solutions equips PCB shops with a deeply integrated preproduction software experience. InCAM®Flex for CAM and InPlan Flex for Engineering work seamlessly to integrate data flow between front-end departments, resulting in smooth and efficient time-saving interactions and processes.
InCAM Flex provides fast, high-precision CAM tooling for flex and rigid-flex manufacturers and enables automatic production data optimization via flex design for manufacturing tools. Combined with powerful flex CAD tools and automatic flex board panelization, InCAM Flex brings with it benefits that are most important for businesses ‒ increasing yields and achieving faster job turnaround. In addition, InCAM Flex seamlessly integrates and shares information with InPlan®Flex Engineering Suite, design and assembly via ODB++, and has a streamlined user interface.
About Frontline PCB Solutions and the Frontline product suite
Frontline is a world expert in preproduction CAM and engineering software solutions for the PCB industry, creating smart, future-oriented technologies and solutions. Frontline has a strong track record of success, with more than 20 years’ experience and over 10,000 installations worldwide. Frontline offers its customers a complete preproduction solution, from design to manufacturing, and builds long-term partnerships with customers, offering ongoing training and consulting.
InCAM — A comprehensive, high-precision CAM solution for HDI and IC packaging; InCAM Flex - A smart CAM Solution for Flex and Rigid-Flex PCB Makers - Genesis 2000 — The industry-leading CAM solution for rigid multilayer PCBs; GenFlex — A complete CAM solution for flex and rigid-flex PCB manufacturing; InPlan — A fully integrated automatic engineering system for optimal PCB manufacturing workflows; InPlan Flex — An automated PCB engineering system for flex and rigid-flex boards; InStack — An automatic stackup designer; InCoupon — An automatic impedance coupon generator, InSolver - An Impedance field solver, and InSight PCB – A web‑based tool for fast and accurate pre-CAM assessment.
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ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
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Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
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U.S. CHIPS Act Funding Detailed on SIA Website
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