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Ucamco Updates Gerber Nested Step & Repeat Proposal
June 8, 2016 | UcamcoEstimated reading time: Less than a minute
Ucamco is extending the Gerber format to make it more efficient in handling fabrication and assembly panels. To allow the Gerber user community to review and comment on the new feature before it is cast in concrete a draft specification is made available for download on the Ucamco website. Vendors/Engineers who want to contribute are invited to send all comments and criticism to gerber@ucamco.com.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photo plotting and direct imaging systems, with a global network of sales and support centres. Headquartered in Ghent, Belgium, Ucamco has over 25 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp. (1998).
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Technica USA Partners with Creative Electron
10/22/2025 | Technica USATechnica USA is proud to announce the partnership with Creative Electron Inc. located in San Marcos, CA.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).