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American Standard Circuits Enhances Via Fill Capabilities with Double Systems
June 23, 2016 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, CEO of American Standard Circuits, has announced that his company recently enhanced their Via Fill capabilities with the installation of a MASS VHF300 Horizontal Hole Filling system with full chamber vacuum capability, accompanied by a MASS ES10 double sided Scavenger unit.
This unit gives ASC the capability of doing both conductive and non-conductive via fill including the ability to plug high aspect ratio holes and blind vias.
“The demand for via fill in terms of technology and volume requirements has steadily been increasing. It was essential that we upgrade our existing processes in order to better fulfill the growing requirements of our customers for higher technology. We put a great deal of focus on making sure all our customers’ needs, both present and future, are met so we have invested over two million dollars in the past 18 months on new and vital equipment acquisitions to do just that and we’re just getting started. Our plan is to be one of the leading high tech PCB fabricators in North America,” stated Mr. Vardya when making the announcement.
About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/Microwave, flex and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include ISO 9001:2008, MIL-PRF 31032, and ITAR registration. American Standard also holds a number of key patents for metal bonding processes. For more information about American Standard Circuits services or to ask one of their technology experts a question, click here.
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