FADEC Alliance Engine Control Electronics will help operate every GE9X
July 18, 2016 | BAE SystemsEstimated reading time: 1 minute

GE Aviation’s all new GE9X engine for the Boeing 777X will feature full authority digital engine controls (FADEC) designed and produced by FADEC Alliance, a joint venture formed by FADEC International and GE. The systems — consisting of a digital computer, called an engine control unit, and its related accessories — control all aspects of aircraft engine performance, such as engine fuel flow and variable engine geometries.
“This contract continues FADEC International’s business relationship with GE onto the next generation of aircraft,” said Dennis Slattery, board member of FADEC Alliance and director of engine systems at BAE Systems. “Through the collaborations between BAE Systems, Safran Electronics & Defense, formerly Sagem, and GE, we have more than 30 years of experience developing engine controls, with an installed base of more than 25,000 engines.”
FADEC International (a BAE Systems and Safran joint venture), has established the FADEC Alliance joint venture with GE to develop, produce, and support FADECs for aircraft engines and related technologies.
FADEC Alliance will be the exclusive FADEC supplier for the GE9X engine, which is the sole engine for the 777X. FADEC Alliance will be responsible for the design, manufacture, and aftermarket support of the system. The partnership leverages the combined experience of FADEC International and its member companies, which have supplied FADEC systems to GE since 1984.
The GE9X will be the most fuel-efficient engine GE has ever produced on a per-pounds-of-thrust basis. It follows the highly successful GE90-115B engine that entered service in 2004.The 777X is Boeing’s newest family of twin-aisle airplanes that builds on the passenger-preferred and market-leading 777. It will be the largest and most efficient twin-engine jet in the world. The 777X is scheduled to begin production in 2017, and first delivery is scheduled for 2020.
Development and production of the FADECs will occur across multiple BAE Systems and Safran sites.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
U.S. Army Begins Fielding BAE Systems’ Mission-critical Software-defined Radios Across Rotary-wing Aviation Fleet
09/08/2025 | BAE SystemsBAE Systems’ AN/ARC-231A Multi-mode Aviation Radio Set (MARS) has completed initial installation and is operationally ready for use today on select U.S. Army rotary-wing aircraft.