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Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai

03/24/2025 | DuPont
DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.

Just Because You Can, Doesn’t Mean You Should

03/20/2025 | Tony Plemel, Flexible Circuit Technologies
Decisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.

ICT Spring Seminar: Nickel Not Welcome Here

03/12/2025 | Pete Starkey, I-Connect007
After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.

Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process

03/10/2025 | Multicircuits
Mike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.

EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection

02/20/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.
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