American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
ACE to Conduct Introductory Selective Soldering Workshop
September 21, 2016 | ACE Production Technologies Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc. is pleased to announce that registration is now open and seats are still available for its upcoming October 18-19 introductory selective soldering workshop.
The introductory workshop will be held October 18-19, 2016 at ACE’s Spokane Valley, WA facility. This comprehensive 2-day workshop is designed to educate and enhance an attendee’s working knowledge of the overall selective soldering process. Topics include component limitations, clearance restrictions, flux chemistries, no-clean processing, and solder joint reliability issues, as well as problem solving and process optimization. The classroom portion will be conducted by well-known process expert Bob Klenke of ITM Consulting while the hands-on portion will be taught by the expert staff members in the ACE application lab. Optionally, attendees can attend a third day for additional hands-on training and are invited to bring their own circuit boards for detailed application analysis.
More than 195 attendees from over 100 companies have participated in previous ACE selective soldering workshops including a 2-day introductory workshop and a 2-day advanced workshop. These highly successful workshops feature open communications and a continuous information steam that has helped attendees advance their skills, techniques and methods involved with the selective soldering process.
This workshop features a combination of classroom and hands-on curriculum that significantly compresses the learning curve for those new to the selective soldering process or those who wish to advance their in-depth knowledge. For more information about this selective soldering workshop, or to register for the workshop, contact Rae Ann Miller at rmiller@ace-protech.com or call 509-924-4898, Ext. 102.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, visit www.ace-protech.com, call 509-924-4898 or email sales@ace-protech.com.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.