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Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf

11/14/2024 | The Occam Group
The Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.

SEMI Europe Recognizes Schneider Electric as a Leader in Diversity and Inclusion at SEMICON Europa 2024

11/14/2024 | SEMI
SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Schneider Electric as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award. Frederic Godemel, Executive Vice President, Power Systems and Services at Schneider Electric accepted the award presented at SEMICON Europa 2024 during the SEMI Networking Night Dinner.  

International Electronics Circuit Exhibition (Shenzhen) Coming Dec. 4–6

11/14/2024 | Edy Yu, I-Connect007
HKPCA hosts the 22nd annual International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show), Dec. 4-6, at the Shenzhen International Convention and Exhibition Center (Bao’an) in Halls 5, 6, 7, and 8. With more than 600 global brands and emerging companies, it is one of the world's largest gatherings for the circuit board and electronic assembly industry. The theme of the event is "AI Powers the Future." It will focus on AI, high-end PCBs, high-performance materials, smart automation, and other hot topics. It will showcase innovative processes and technologies across the PCB and PCBA industry chain, bringing together global elites and resources to drive ongoing development.

TRI at SMTA Silicon Valley Expo & Tech Forum 2024

11/12/2024 | TRI
Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will join the SMTA Silicon Valley Expo & Tech Forum 2024 on December 5, 2024, at the Fremont Marriott Silicon Valley.

An Update on USPAE's Strategic Initiatives

11/12/2024 | Marcy LaRont, I-Connect007
James Will became executive director of the U.S. Partnership for Assured Electronics (USPAE) in May and now provides this update on the group's strategic initiatives. The organization, which is affiliated with IPC, recently transitioned to being a 501(c)(3). It is navigating through a dynamic landscape, working to enhance our microelectronics manufacturing capabilities including PCBs, and adapt to emerging technology trends and market challenges.
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