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Marcy’s Musings: From Pitch to PO—The Sales Stack

07/21/2025 | Marcy LaRont -- Column: Marcy's Musings
It is a foundational truth that a company lives and dies by its sales. Receiving that PO or contract starts the operational chain. It is the purest symbol of the machinations of the business process: You are paying me for something I am doing, making, or sourcing for you. Then, every single thing a business does in executing and fulfilling that sales agreement speaks directly to customer experience and whether more POs will follow. You won't keep customers if you don't make a quality product and provide strong customer service.

July 2025 PCB007 Magazine: Sales—From Pitch to PO

07/18/2025 |
Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.

Tightening of LPDDR4X Supply Drives Up Prices; Smartphone Brands to Accelerate Adoption of LPDDR5X

07/17/2025 | TrendForce
TrendForce’s latest investigations reveal that major Korean and U.S. memory suppliers are expected to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.

Beyond Design: Refining Design Constraints

07/17/2025 | Barry Olney -- Column: Beyond Design
Before starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.

Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4

07/16/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
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