Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
It’s Only Common Sense: The Phone Is Still Your Competitive Advantage
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 18, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference. As for my bonus piece, keep reading to see what the real buzz is about.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
Published July 16
I had the opportunity to go in-depth with Martyn Gaudion, managing director at Polar Instruments and a three-time author in the I-Connect007 book series, on his latest installment, The Printed Circuit Designer’s Guide to…More Secrets of High-Speed PCBs. We discuss the book’s contents, why it was important to continue the topic, and who should get a copy. As always, adding the author’s personal voice and perspective adds insight and understanding.
Copper Price Surge Raises Alarms for Electronics
Published July 15
The Global Electronics Association is reporting major turbulence in the copper market following the Trump administration’s announced 50% tariff on imported copper, slated to start Aug. 1, 2025, as reported here. Most of the copper used in the U.S. is sourced from the Americas, but the news was enough to cause a surge in the copper market.
TTM Technologies Prepares For the Future with the Acquisition of a Facility in Wisconsin and Land in Penang
Published July 10
TTM just added 750,000 square feet of manufacturing space in Eau Claire, Wisconsin, where TDK was the previous owner of the building. This is in addition to a land purchase in Malaysia slated for further growth. This article provides a ton of details, shedding insight on how TTM plans to respond to shifting regional dynamics worldwide.
Report: Broadcom Scraps $1 Billion Chip Investment in Spain
Published July 15
In what I would interpret as a setback for EU supply chain resilience, Broadcom has ended its plans to build a plant for final assembly and testing of ICs in Spain. Collapsed government talks were the reason given by Broadcom. Get more details here.
Digital Twin Concept in Copper Electroplating Process Performance
Published July 11
Periodically, we publish a significant research paper in our magazines. These papers address an area of development we determine to be of particular practical interest to readers. Aga Franczak’s paper from the 2025 Pan-European Design Conference takes a hard look at improving copper thieving performance through use of a digital twin for the copper plating process. Industry 4.0 and digital twin concepts made early inroads in assembly, now researchers are using those concepts to improve board fabrication. For readers interested in fabrication, this is an important read.
BONUS!
Nvidia’s $4 Trillion Milestone Signals AI Must-have for Investors
Published July 10
I’m including this news item as a bonus sixth, because a market cap of $4 trillion simply cannot be left unnoticed. Nvidia is now the most valuable business on Earth. While that is sinking in, read all about it here.
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Brent Fischthal - Koh YoungSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.