Dawn of the Digital DX Economy: New Rules, Roles & Requirements
September 28, 2016 | Business WireEstimated reading time: 2 minutes
International Data Corporation (IDC) today announced the comprehensive schedule for its annual FutureScape predictions presentations. Starting with a live Web conference to be held November 1st at 12:00 p.m. EST, IDC Chief Analyst Frank Gens will present ten key developments in the tech world that, over the next 18-36 months - and beyond, will impact every enterprise's ability to grow and compete. The predictions track the continuing emergence and evolution of the 3rd Platform/Digital Transformation (DX) marketplace.
Following the live event on November 1st, IDC will offer more than 30 Web conferences through December 15, 2016, covering topics including Digital Transformation (DX), CIO Agenda, 3D Printing, Connected Car, Smart Cities, Payments, Wearables, and more.
Over the past five years, IDC has explored the maturing of the 3rd Platform's Four Pillars (cloud, mobile, social, and big data technologies), the arrival of Innovation Accelerators (IoT, 3D printing, robotics, etc.), and the first wave of Digital Transformation players, services, and solutions in every industry. This year IDC will predict the themes and events for the next chapter in this evolution (2017-2020+), including how the Four Pillars are shifting into a new evolutionary stage to support a scaled-up DX Economy, the maturing (and mashing up) of key Innovation Accelerators, and the take-off stage of the DX Economy, highlighting what lies beyond the near- to mid-term 3rd Platform/DX world.
"Since 2011, businesses have been reshaped by technology, new contenders have emerged, and the center of gravity has shifted to the customer," said Gens. "Our series of annual predictions are a critical resource as today's top business and IT executives adjust their strategic three-year plans to reflect the new relationship between technology and business strategy. The depth and breadth of our research will help organizations discover how to accelerate DX across the enterprise, transform the IT organization to be an effective technology partner to the business, and reposition the organization as a DX partner in place of a technology supplier."
"Successful CIOs of the future will be judged by their ability to drive innovation with the business, integrate innovations with the enterprise systems, and incorporate new techniques and talent into existing IT operations. While many CIOs will face their biggest crisis in leadership, on the other side awaits an IT organization that is primed to succeed in the digital economy," said Meredith Whalen, senior vice president of IT Executive, Software, Services and Industry Research at IDC. "This year's CIO Agenda Predictions will be dedicated to guiding IT leaders in transforming their organization."
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.