Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Altron Partners with Mirtec to Provide Total Quality 3D AOI Solution
November 7, 2016 | MirtecEstimated reading time: 1 minute
Mirtec is pleased to announce that ALTRON, Inc., a veteran-owned, service-orientated, contract manufacturing company specializing in high-quality circuit board and mechanical box build assemblies, has selected Mirtec as its 3D AOI partner with the purchase of six MV-7 OMNI 3D AOI machines.
"Altron is a full-service contract manufacturer dedicated to the production of quality electronic and electro-mechanical assemblies. Our company provides services and order fulfillment to a wide variety of industries. ALTRON is dedicated to customer satisfaction and growth through continuous quality improvements, with certification in AS9100 and ISO13485. We have a strong commitment to continuous quality improvement which prompted our recent acquisition of 6 new Mirtec MV-7 OMNI 3D AOI systems. After evaluating several leading 3D AOI vendors, we selected Mirtec as the best solution to meet our ongoing quality initiatives," stated Al Phillips, Owner and CEO of Altron.
"We, at Mirtec, understand that Electronic Manufacturers are becoming ever more selective in purchasing equipment that will add value to their business and provide them with a much needed competitive edge in this highly competitive industry,” said Brian D’Amico, President of Mirtec Corp. "With this in mind, an increasing number of manufacturers are relying upon 3D Automated Optical Inspection (AOI) equipment to help increase profitability by improving production yields and reducing costly rework. We are extremely pleased to have been awarded ALTRON’s 3D AOI business. We look forward to a long and prosperous relationship between our two organizations.”
Mirtec's award-winning MV-7 OMNI 3D AOI Machines are configured with Mirtec's exclusive OMNI-VISION® 3D Inspection System which combines 15 Mega Pixel CoaXPress Camera Technology with Mirtec's revolutionary Digital Multi-Frequency Quad Moiré 3D System to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-7 OMNI machine features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.