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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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EU Commission Launches Consultation on Two New Exemption Requests
November 21, 2016 | IPCEstimated reading time: Less than a minute
The EU RoHS Directive 2011/65/EU restricts the use of certain hazardous substances in electrical and electronic equipment. BiPRO GmbH has been commissioned by DG ENV to provide technical assistance regarding the evaluation of applications and the related stakeholder consultations, for the following two new exemptions:
- Cadmium in video cameras designed for use in environments exposed to ionising radiation and
- Lead and cadmium in PVC profiles of electric windows and doors
The consultation for the two applications for exemption will be open until Friday, December 9, 2016. Questionnaires to the stakeholders containing targeted questions for the consultation have been drafted for each of the exemption requests and available for each exemption request respectively click here.
A dedicated project website has been established here.
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04/23/2025 | FoxconnHon Hai Technology Group, the world's largest technology manufacturing and service provider, has actively responded to the United Nations Sustainable Development Goals (SDGs).
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
Hitachi Announces Completion of New Production Facility for Semiconductor Manufacturing Equipment
04/01/2025 | JCN NewswireHitachi High-Tech Corporation announced that the new production facility for semiconductormanufacturing equipment (etch systems), which had been under construction since December 2023 in the Kasado area (Kudamatsu City, Yamaguchi Prefecture), was completed and started the operation on March 17, 2025.
Paige Fiet: From Emerging Engineer to Quality at TTM
03/19/2025 | Marcy LaRont, PCB007 MagazinePaige Fiet is a graduate of the IPC Emerging Engineer program and now works at TTM Technologies in Logan, Utah. She was an IPC Student Board Member and has been a columnist for I-Connect007. She is a stellar example and an encouragement to other young engineers about how to be successful in your early career.