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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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EU Commission Launches Consultation on Two New Exemption Requests
November 21, 2016 | IPCEstimated reading time: Less than a minute
The EU RoHS Directive 2011/65/EU restricts the use of certain hazardous substances in electrical and electronic equipment. BiPRO GmbH has been commissioned by DG ENV to provide technical assistance regarding the evaluation of applications and the related stakeholder consultations, for the following two new exemptions:
- Cadmium in video cameras designed for use in environments exposed to ionising radiation and
- Lead and cadmium in PVC profiles of electric windows and doors
The consultation for the two applications for exemption will be open until Friday, December 9, 2016. Questionnaires to the stakeholders containing targeted questions for the consultation have been drafted for each of the exemption requests and available for each exemption request respectively click here.
A dedicated project website has been established here.
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PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
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SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.