Solder Paste Market to Experience Further Growth
December 14, 2016 | openPREstimated reading time: 3 minutes
Solder paste, also known as solder cream is used to connect leads on surface mounted integrated circuit chips to the attachment points on the printed circuit boards, which are commonly used in all electronic devices. It is generally applied as a paste through stencil or dispensing tubes on the leads on printed circuit boards, followed by heating the paste in order for it to melt and fuse the connection. Soldering paste is an extremely important ingredient in the electronic circuit manufacturing industry. By physical appearance, it is a gray and putty like material. Solder pastes are of different compositions depending upon their end use requirements. Some of the common solder pastes are tin – lead alloy, tin – silver – copper alloy, tin – silver – copper alloy and tin – antimony alloy.
The driving force behind the solder alloy market is the burgeoning demand from electronic manufacturing services. The market has especially witnessed a bullish run since the last two decades, is expected to grow further with the penetration of information technology, and enabled services in human life across the world.
Solder paste is essential for all printed circuit boards and semiconductors. Printed circuit boards find application in almost all electronic devices including computers, laptops, smart phones, tablets, televisions, medical testing equipments, fiber optic receptors, nuclear detection systems, data storage devices and weather analysis equipment among many others. Printed circuit boards are also used in automotives, marine vehicles and aerospace industry for electronic functions. Traditional single layer printed circuit boards are gradually evolving into multilayer printed circuit board with extensive functionality. The technological advancements in the PCB market is expected to transform into higher demand for solder paste.
The market for solder paste is largely unhindered by substitute products. However, the demand for lead free solder paste has been increasing due to environmental concerns of lead. According to estimates more than 30 million tons of electronic waste are accumulated each year and the lead content in electronic wastes create havoc on environmental balance. The demand for lead containing alloys is expected to decline over the period for the solder paste market. However, there are no significant restraints to the solder paste market as a whole.
The global outlook for electronic equipments and applications holds promise as consumer electronics has exhibited tremendous growth over the past decade and expected to continue to rise in the foreseeable future. This presents tremendous opportunity for solder paste market especially in the developing regions of Asia Pacific, Latin America and Africa.
China accounts for the largest demand for solder paste in the world. China is the largest producer of electronic devices and ancillary parts in the world. The export oriented electronics manufacturing services in China is the main reason behind the surging demand in the region. China is also the largest manufacturer of solder paste in the world. Asia Pacific accounts for over 50% of the global demand, lead by China, Japan, Korea and India. Demand for solder paste from North America and Europe follow that from Asia Pacific.
Some of the companies operating in the solder paste market are SMT International LLC, Kester, AIM Metals and Alloys, LLC, Chung I Silver Solder Co., Ltd., Ku Ping Enterprise Co., Ltd., Shenmao Technology Inc. Chemco Industry Corporation, Dyfenco Electronic Chemical Corporation among many others.
About Transparency Market Research
Transparency Market Research (TMR) is a global market intelligence company providing business information reports and services. The company’s exclusive blend of quantitative forecasting and trend analysis provides forward-looking insights for decision makers. TMR’s experienced team of analysts, researchers, and consultants use proprietary data sources and various tools and techniques to gather and analyze information.
Suggested Items
Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
05/27/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has successfully supported Phoenix Systems UK Ltd in its investment in robotic soldering technology to further enhance its through-hole technology (THT) assembly processes.
Advancements in High-reliability Alloys for Automotive and High-performance Applications
05/22/2025 | Barry Matties, I-Connect007At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA Innolot, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.