ACE to Conduct Introductory Selective Soldering Workshop
December 16, 2016 | ACE Production Technologies Inc.Estimated reading time: 2 minutes
ACE Production Technologies Inc., a leading supplier of selective soldering systems and lead tinning systems, is pleased to announce that registration is now open and seats are available for its upcoming introductory selective soldering workshop.
This introductory workshop will be held January 24-25, 2017 at ACE’s Spokane Valley, WA facility. This comprehensive two-day workshop is designed to educate and enhance an attendee’s working knowledge of the overall selective soldering process.
Who Should Attend
- Process Engineers
- Manufacturing Engineers
- Production Technicians
- Quality Personnel
What You Will Learn
- How to improve your selective soldering effectiveness
- Programming tips and tricks
- How to reduce selective soldering defects
- Advanced process troubleshooting techniques
- How to reduce post-solder rework and increase yields
The classroom session focuses on the technical aspects of the selective soldering process and describes the process variables to enhance the flexibility, reliability and quality provided by all types of selective soldering equipment. Your questions about using a selective solder process, and differences in process parameters when working with tin-lead and lead-free solder alloys will be covered in detail. Topics Include:
- Fundamentals of through-hole soldering
- Solderability issues
- Lead-free and tin-lead solder alloys
- Flux application and no-clean processing
- Preheating and thermal performance
- Design guidelines and quality measurement
- Process troubleshooting guidelines
- Advanced process optimization techniques
This workshop entitled "Mastering Selective Soldering Processing and Manufacturability" features a combination of classroom curriculum and hands-on training that is designed to educate and enhance an attendee’s working knowledge of the overall selective soldering process. The classroom portion of the workshop will be presented by well-known process expert Bob Klenke, Principal Consultant with ITM Consulting. He has more than 15 years of direct hands-on experience with selective soldering technology and is a frequent instructor for selective soldering, wave soldering and X-ray inspection workshops at APEX and SMTA International conferences.
The hands-on portion of the workshop will be taught by the expert staff members in the ACE application lab. During the hands-on portion attendees will assemble, program, selective solder and evaluate a specially designed test board for 100% plated through-hole fill using X-ray inspection.
Attendees are encouraged to attend a third day for additional hands-on training and are invited to bring their most challenging circuit board assemblies from their workplace for additional testing and detailed application analysis.
More than 225 individuals from over 107 different companies have attended previous ACE selective soldering workshops including a 2-day introductory workshop and a 2-day advanced workshop. These highly successful workshops feature open communications and a continuous information steam that has helped attendees advance their skills, techniques and methods involved with the selective soldering process.
This highly acclaimed workshop features a combination of classroom and hands-on curriculum that significantly compresses the learning curve for those new to the selective soldering process or those who wish to advance their in-depth knowledge. For more information about this selective soldering workshop, or to register for the workshop, contact Kristi Kellar at kkellar@ace-protech.com or call 509-924-4898, Ext. 106.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here, call 509-924-4898 or email sales@ace-protech.com.
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.